Cancel my college entrance examination? The development of the sixth-generation fighter shocked the

Chapter 848

"With the joint efforts of all members of our semiconductor development team, we have successfully developed a new chip!"

"Although this chip has not been perfected in terms of performance and comprehensive functions, we believe that even if it is a semi-finished product, if it is in the current international semiconductor competition, I believe that no semiconductor product can compete with this product!"

"Even a chip with a precision of 2 nanometers can only barely touch the semiconductor product we developed!"

As Sma Wanyi's words resounded in the meeting room of the Eagle Sauce Country, all the high-level officials of the Eagle Sauce Country present, including the head of the Eagle Sauce Country, Biden, immediately became short of breath and looked at Sma Wanyi with expectation and shock.

You know, in today's semiconductor industry.

2-nanometer precision chips have always been a watershed.

It has blocked countless leading countries in the semiconductor industry.

So far, no country has announced the successful development of 2-nanometer precision chips.

And Sma Wanyi now says that he has developed a new chip.

Even a semi-finished product can compete with a chip with 2-nanometer precision.

What kind of product is this!

Isn't this a deliberate gimmick to get away with it?

This instantly aroused the curiosity of everyone present.

A smug smile appeared on the corner of Sima Wanyi's mouth.

In the expectant and curious eyes of everyone, Sima Wanyi slowly spoke.

"That's the three-dimensional stacked chip!"

As soon as these words came out, the originally silent meeting room of the United States exploded.

Even those senior officials of the United States who knew little about the semiconductor industry and experts in the aerospace field were stunned and looked at Sima Wanyi.

Their expressions were frozen but they all showed a sense of disbelief.

Because the reputation of this so-called three-dimensional stacked chip in the scientific research community is no less than that of the 2-nanometer precision chip, and even more than that.

Moreover, this is indeed a new chip that is different from the traditional one!

However, the difficulty of developing a three-dimensional stacked chip is extremely high, even exceeding the development of a 2-nanometer precision chip.

Because although some countries in the semiconductor industry, such as Dragon Country, have conducted research on three-dimensional stacked chips, no country has succeeded so far. Even the countries of Windmill Country, it can even be said that they have not made any progress at all! The development of three-dimensional stacked chips has been recognized as a difficult problem since the moment the concept was proposed, and it is considered to be a product that only exists in concept. And now Sima Wanyi actually said that their team has developed a three-dimensional stacked chip. Even if it is just a semi-finished product, it makes the people present who were originally calm and unconcerned feel unbelievable! Seeing that everyone looked so unbelievable. Sima Wanyi smiled with satisfaction, as if he had guessed that when he said this, everyone's reaction would be like this. "Since everyone is so unbelievable, let me tell you what advantages 3D stacked chips have over traditional chips!"

"Let me show you why, in our opinion, even a semi-finished 3D stacked chip still has a great chance of winning the championship in this international semiconductor competition!"

Compared with traditional chips, 3D stacked chips have many advantages, which make 3D stacked chips have broad application prospects in high-performance computing, mobile devices, the Internet of Things and other fields. The following are the main advantages of 3D stacked chips:

"First of all, 3D stacked chips have a higher degree of integration than traditional chips."

"By stacking multiple chip layers in the vertical direction, 3D stacked chips can significantly increase the number of circuit elements per unit area and achieve a higher degree of integration."

"Do you know what this means?"

Sima Wanyi looked at the helpless expressions of the Eagle Sauce country's senior executives below, smiled complacently, and continued.

"This means that in the same volume, 3D stacked chips can integrate more functions and performance, providing designers with more design flexibility."

"Secondly, compared with traditional chips, 3D stacked chips have shorter interconnection lengths."

"In traditional chips, the interconnection between circuit elements needs to span the entire chip plane, resulting in a longer interconnection length."

"In 3D stacked chips, since the circuit elements are stacked in the vertical direction, a shorter interconnection length can be achieved. Shorter interconnection length helps reduce power consumption, improve signal transmission speed and reliability."

"In addition, all countries continue toThe reason for developing higher precision chips is to have better power management. "

"And the three-dimensional precision chip, even a semi-finished product, can rival the 2-nanometer precision chip for an important reason!"

"By shortening the interconnection length and reducing the capacitance effect, the three-dimensional stacked chip can reduce energy loss and achieve better power management. This is especially important for power-sensitive fields such as mobile devices and IoT devices, because they require longer battery life."

"In addition, the three-dimensional stacked chip has higher bandwidth and performance."

"Because the three-dimensional stacked chips can achieve shorter interconnection lengths and higher integration, they can support higher bandwidth and performance. This makes the three-dimensional stacked chip have a wide range of application prospects in high-performance computing, data centers, cloud computing and other fields."

"In addition, we use the immersion liquid cooling overall solution for this three-dimensional stacked chip, which makes it have thermal management that completely surpasses traditional chips."

"In the three-dimensional stacked chip, better thermal management can be achieved by stacking multiple chip layers in the vertical direction. By distributing components with higher heat generation on different chip layers, the overall temperature can be reduced and the reliability and stability of the chip can be improved. "

"In addition, 3D stacked chips have higher flexibility."

"You know, we stack chip layers with different functions in the vertical direction of 3D stacked chips to achieve higher design flexibility. This flexibility enables 3D stacked chips to adapt to various complex application scenarios and needs."

"These are an important reason why 3D stacked chips are not inferior to chips with a precision of 2 nanometers even though they are only semi-finished products!"

...

After saying this, Sima Wanyi grinned complacently.

The high-level officials of the Eagle Sauce Country below came to their senses after a while.

Looking at Sima Wanyi who was proud on the stage, they did not feel any dissatisfaction.

Because he deserves it!